Definition and Application of Phenolic Resin Adhesive

Phenolic resin is prepared by condensation reaction of benzene and aldehyde in the presence of a catalyst, and oligomers with a relative molecular weight of 500-1000 are used as adhesives.

Although the emergence of new adhesives has replaced phenolic resin adhesives in many aspects, their unique advantages still make them important and will continue to have significant development and application.

Characteristics and Applications

Phenolic resin adhesive has the following characteristics:

Phenolic resin has high polarity and good adhesion to metals and most non metals, with high bonding strength. Due to the presence of a large number of benzene rings in phenolic resin, which can crosslink into a solid structure and have high rigidity, it has high heat resistance, creep resistance, burn resistance, and good dimensional stability. Water resistance, oil resistance, wear resistance, chemical resistance, mold resistance, aging resistance, etc., with excellent electrical insulation performance. It is easy to modify itself and can also modify other adhesives. High brittleness, low peel strength, not resistant to impact and vibration. High temperature and high pressure curing are required for a long time, resulting in a high shrinkage rate and a darker color of the adhesive layer.